RELY Design for RELIABILITY of SoCs for Applications like Transportation, Medical, and Industrial Automation

Goal

The CATRENE / BMBF project RELY (grant number 01M3091) develops new methods for the design of reliable embedded systems for applications such as transportation, medical and automation. The OFFIS group "Analysis of Nanometer ICs" in cooperation with Infineon and TU Munich researches one of the most relevant aging effects of modern transistor technologies - the Bias Temperature Instability effect. This deteriorates over operating periods of years, the performance of the transistors. In traditional embedded systems this effect is not noticeable at first, until it finally comes to an almost simultaneous failure of many subsystems. Depending on the application, this may have different effects: While it is perfectly acceptable for communication devices to have a life span of just a few years, use of these new technologies would result to a virtually guaranteed failure in the automotive and aircraft application and thus to increased maintenance costs due to preventive replacement of systems. For implanted systems, which require that a maintenance can be avoided for many years, the latest technology without a new design techniques is almost unthinkable.

Persons

Scientific Director

Publications
MoRV: Modelling Reliability under Variability

Malte Metzdorf, Reef Eilers, Domenik Helms, Wolfgang Nebel, Kay-Uwe Giering, Roland Jancke, Gerhard Rzepa, Tibor Grasser, Markus Karner, Praveen Raghavan, Ben Kaczer, Dan Alexandrescu, Adrian Evans, Gunnar Rott, Peter Rotter, Hans Reisinger, Wolfgang Gustin; SELSE 12 proceedings; 03 / 2016

Phase space based NBTI model

Eilers, Reef and Metzdorf, Malte and Rosinger, Sven and Helms, Domenik and Nebel, Wolfgang; 009 / 2012

RELY - Design for Reliability of SoCs

Helms, Domenik and Eilers, Reef and Oppenheimer, Frank and Nebel, Wolfgang; Proceedings of the 2013 IEEE European Test Symposium; 05 / 2013

Abstraktion des Switching-Trap-Modells für eine leistungsorientierte NBTI-Simulation

Eilers, Reef and Bergemann, Carl and Helms, Domenik and Nebel, Wolfgang; Proceedings of edaWorkshop 2013; 05 / 2013

Facilitating Cross-Layer Reliability Management through Universal Reliability Information Exchange

Enrico Costenaro, Domenik Helms, Nematollah Bidokhti, Adrian Evans, Maximilian Glorieux and Dan Alexandrescu; DAC - Design Automation Conference; 06 / 2015

Considering Variation and Aging in a Full Chip Design Methodology at System Level

Domenik Helms and Kim Grüttner and Reef Eilers and Malte Metzdorf and Kai Hylla and Frank Poppen and Wolfgang Nebel; Electronic System Level Synthesis Conference (ESLsyn), Proceedings of the 2014; 06 / 2014

Considering Variation and Aging in a Full Chip Design Methodology at System Level

Domenik Helms and Kim Grüttner and Reef Eilers and Malte Metzdorf and Kai Hylla and Frank Poppen and Wolfgang Nebel; Proceedings of The 2014 Electronic System Level Synthesis Conference (ESLsyn'14), May 31- Jun 01 2014, San Francisco, CA, USA; 05 / 2014

Abstracting TCAD aging models above the circuit level

Malte Metzdorf, Domenik Helms, Reef Eilers, Wolfgang Nebel; DATE - Design, Automation, and Test in Europe; 03 / 2015

RT Level Timing Model for Aging Prediction

Nils Koppaetzky, Malte Metzdorf, Reef Eilers, Domenik Helms, Wolfgang Nebel; DATE; 03 / 2016

Analysis of NBTI Effects on High Frequency Digital Circuits

Ahmet Unutulmaz, Domenik Helms, Reef Eilers, Malte Metzdorf, Ben Kaczer, Wolfgang Nebel; DATE; 03 / 2016

Leakage models for high level power estimation

Domenik Helms ; Reef Eilers ; Malte Metzdorf ; Wolfgang Nebel; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems; 11 / 2017

Partners
Infineon Technologies AG
www.infineon.com
Atmel Corporation
www.atmel.com
EADS Deutschland GmbH (bis 31.05.2014 - danach Airbus Defence and Space GmbH)
www.eads.com
EADS Innovation Works
www.eads.com
MunEDA GmbH
www.muneda.com
STMicroelectronics srl
www.st.com
TU München
www.tum.de
Universität Bremen - ITEM Institut für Theoretische Elektrotechnik und Mikroelektronik
www.item.uni-bremen.de
Gottfried Wilhelm Leibniz Universität Hannover
www.uni-hannover.de
X-FAB Semiconductor Foundries AG
www.xfab.de
Ecole d´Ingenieur Télécom ParisTech (Télécom ParisTech), France
www.telecom-paristech.fr
CEA LIST
www-list.cea.fr
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie IISB
www.iisb.fraunhofer.de
Fraunhofer-Institut für Integrierte Schaltungen IIS Institutsteil Entwurfsautomatisierung EAS
www.eas.iis.fraunhofer.de

Duration

Start: 30.04.2011
End: 29.04.2014